Adhesion reliability
- Maximum first layer speed is 50mm/s to improve adhesion reliability and bottom layer quality for all materials
PVA adhesion
Use the PVA and BAM build plate and volume temperature when they are used as support material. The combi PLA/PVA will now have a 60C build plate temp. iso 55C to improve PVA adhesion.
Note: Adding an outer brim did not seem to help much, so did not add it
Holes in walls PETG
- Unretract speed from 45mm/s to 15mm/s to reduce bubbles in the walls
Print quality PC and CPE+
- Reduce retract length to prevent air capture during unretracts
- Inner wall before outer wall to place any gas bubbles in the inner wall for PC
- Inner wall speed equal to outer wall speed to prevent flow jumps for PC
- Lowered the flow rate to 95% for PC to prevent over extrusion and pressure build up
- Enable alternating wall to reduce warping stress
- 10C higher nozzle temperature (PC:290C, CPE+: 280C) to remelt the line below
- Keep initial and final temperature the same to prevent oozing
- 5C higher bed temperature (PC:115C, CPE+: 115C) to increase bed adhesion
- Chamber temperature to 50C (max. value S line)
- Enable a brim to reduce warping
Dimensional accuracy
- Increase xy_offset from -0.02 to +0.05mm to compensate
Prevent prime tower breaking
- Reduce prime tower speed to 50mm/s
- Reduce prime tower jerk to 2000mm/s3
- Increased minimum purge volume from 10 to 20mm3 for PVA (not for the other materials did not seem to work for them)
- Lower PVA initial and final temperatures to 215 and 210 resp.
Oozing during nozzle switches
- Set enable cool_during_extruder_switch to “all fans”
- Lower PVA initial and final temperatures to 215 and 210 resp.
Tree support improvements
- Decrease max. branch angle from 60 to 50 to prevent branches to overhang too much. Set preferred to 35 degree
- Increase Branch diameter from 5 to 8mm to get sturdier branches
Better thin wall structures
Increase the wall and skin thickness from 3 to 4 line widths for the Engineering intent to improve the print quality of thin walled injection molded like models.
Removing AA+0.6 core for the S line machines
S6/S8: Set xy_offset to 0.1mm to compensate (cyclinder outer walls 0.2mm to small)
S6/S8: Travel speed to 500mm/s (this is PP-606)
S6/S8: Maximum first layer speed is 50mm/s to improve adhesion reliability and bottom layer quality
PLA: Reduce intial and final nozzle temperature with 10C (195C) to reduce oozing on model
PETG: Unretract speed from 45mm/s to 15mm/s to reduce bubbles in the walls
PVA: Increase prime tower purge volume from 10.0mm3 to 20mm3 to improve tower stability (esp in combi with high temp model materials)
PC and CPE+: Reduce warping
- Alternating wall
- 10C higher nozzle temperature (PC:290C, CPE+: 280C) to remelt the line below
- Keep initial and final temperature the same
- 5C higher bed temperature (PC:115C, CPE+: 280C) to increase bed adhesion
- Chamber temperature 50C (max value S line)
PP-625
- reduce retract length, inner wall before outer wall, inner wall speed equal to outer wall.
We also lowered the flow rate to 95% for PC because we noticed that it was over extruding.
CPE: CPE is VERY fragile to printer over itself or bumps. Lower all speeds to 40mm/s, goto 'lines' infill type to prevent crossing over lines, 3 walls to prevent issues with infill to reach the outer wall.
PP-607
CURA-11911
For settings inside the screen, they are translated through the SettingDefinitionModel, but we don't use one here, so we have to translate it explicitely
